Expertise
Board-level power electronics engineering
Power trees, high-current conversion and telemetry at board level. Final power rating and test depth are defined per project.
Problems we address
- FPGA, GPU or display rails are specified without a conversion architecture.
- Transient, protection and telemetry are left until the first silicon spins.
- Thermal and cooling method are not in the same conversation as current density.
Inputs required
- Input voltage, output rails, continuous and peak current
- Efficiency and cooling targets
- Preferred semiconductor platforms or part numbers if any
- Target price only when the customer can disclose it
Technical scope
- System power-tree definition
- High-current point-of-load and multiphase conversion
- SPS / DrMOS and controller evaluation
- Protection, hot-swap / eFuse and monitoring
- Thermal integration notes, including liquid-cooling interfaces when relevant
Component selection is based on electrical performance, lifecycle, availability, cost and project requirements.
Engineering deliverables
- Power architecture notes and rail list
- Device evaluation record
- Schematic and layout handoff when the board is in scope
- Validation plan for the agreed tests
Development process
- 01 Power-tree and risk review
- 02 Controller / power-stage shortlist
- 03 Board implementation when contracted
- 04 Bring-up against the written test list
Related solutions
Bring Us Your Engineering Challenge
Share your application, key interfaces, performance targets and development schedule. We will review the technical scope and propose a practical starting point.